SOLDER CREEP-FATIGUE MODEL PARAMETERS FOR SAC & SNAG LEAD-FREE SOLDER JOINT RELIABILITY ESTIMATION

摘要

For many of the Pb-free solders required under the European RoHS directive, there is now sufficient information, primarily in the form of the results of accelerated thermal cycling of various levels of severity, to develop acceleration models for the creep-fatigue of these solders. In this paper the parameters for the SAC405/305, SAC205, SAC105 and SnAg to replace the parameters for eutectic SnPb in the well-established Engelmaier-Wild solder creep-fatigue model.