Simulation of TSV copper electrodeposition process with additives

摘要

The kinetics which explained the Copper Super-filling by electrodepostition was investigated since the copper deposition became the standard technique for TSV. A simple numerical model is built to explain the copper deposition process. Consider with the effect of the accelerator, a linear equation is built to explain the relationship between the exchange current density and the coverage of accelerator as well as the relationship of the potential and the coverage of accelerator. The parameter of the equation is investigated in the article. The results show that the linear equation indicates process of copper electrodeposition sufficiently with properly parameters.