Comparison of advanced package warpage measurement metrologies

摘要

The metrology used to characterize, measure, and present the dynamic warpage of electronic packages as a function of temperature has become a critical tool in the electronics industry. Existing JEDEC standard JESD22-B112A lists the four metrologies of shadow moiré, digital fringe projection, confocal and digital image correlation. Each of these has distinct advantages and disadvantages depending on the required use model and application. A series of identical measurement scenarios was applied to each metrology in an attempt to establish constructive comparisons of capability and use across specific tools commonly used for each metrology today. Key parameters targeted in these evaluations included field of view (FOV), oven capabilities, measurement preparation and software capabilities. The intent is not to declare a best tool but rather to provide comparative aspects across the metrologies and tools for those considering a specific use model.