MOLD FOR MOLDING TEST PIECE FOR WARPAGE MEASUREMENT OF PACKAGE RESIN AND MOLDING METHOD OF TEST PIECE

摘要

A mold for manufacturing a test piece for a warpage measurement of a package resin and a manufacturing method thereof are provided to control the generation of warpage by improving flow and modulus of the package resin. A lower block(21) has an internal space. An upper plate(10) has an injection hole(11) for injecting a resin. The upper plate closes an upper portion of the lower block and is assembled. A middle block(12) has a runner(13) through the injection hole. The middle block is arranged in the internal space of the lower block to form a cavity. A support block(15) is arranged on a lower portion of the middle block in the internal space of the lower block and varies cavity capacity. A driving unit is arranged in the internal space of the lower block and raises or drops the support block.