机译:使用翘曲测量改善成型包装的有限元仿真
Fraunhofer Institute for Reliability and Microintegration [IZM], Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration [IZM], Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration [IZM], Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration [IZM], Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Technical University Berlin, Microperipheric Center, Germany;
Technical University Berlin, Microperipheric Center, Germany;
Reliability; Warpage; Finite element methods; Thermoire; Mold compound; Aging;
机译:气体辅助注射成型零件的结构性能,成型工艺和翘曲的综合模拟。III。模具壁温度的循环,瞬态变化的模拟
机译:玻璃纤维增强成型矮零件的空隙和翘曲的测量和数值模拟
机译:扇出晶圆级包装的成型晶圆的翘曲特性
机译:利用Shadow Morie系统对绿色EMC成型的层压包装进行有限元分析和现场翘曲监测
机译:对流回流投影云纹翘曲测量系统的开发,以及受翘曲影响的电路板组件上焊料凸点可靠性的预测。
机译:嵌入集成电路封装的硅芯片翘曲的无损X射线衍射测量
机译:模具厚度对模制引线框架纱线纱线扭曲的影响研究