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NOVEL CUSTOMIZABLE RELEASE LAYERS TO ENABLE LOW WARPAGE ARCHITECTURES FOR ADVANCED PACKAGING APPLICATIONS
NOVEL CUSTOMIZABLE RELEASE LAYERS TO ENABLE LOW WARPAGE ARCHITECTURES FOR ADVANCED PACKAGING APPLICATIONS
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机译:新型可定制发布层,可实现高级包装应用中的低翘曲结构
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摘要
Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a monolayer having a plurality of first molecules over the first surface of the package substrate. In an embodiment, the first molecules each comprise a first functional group attached to the first surface, and a first release moiety attached to the first functional group.
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