Semiconductor device, method of manufacturing the same

摘要

PROBLEM TO BE SOLVED: To enhance heat dissipation of a pellet by forming protrusions and recesses at least partially on the outer circumference at a part of a heat sink exposed from sealing resin. ;SOLUTION: Protrusions and recesses are formed on a part of outer circumference at the end part 28, i.e., the end face 30, of a heat sink 23 exposed back and forth from a resin member 26. Outer part 27 of a plurality lead terminals 24 projecting from the opposite side faces of the resin member 26 is connected with a plurality of signal lines on a circuit board and the end part 28 of the heat plate 23 projecting back and forth from the lower part of the resin member 26 is connected with the ground line on the circuit board by soldering, or the like. Since protrusions and recesses are formed on the end face 30 of the heat plate 23 soldered to a conductor pattern formed on the circuit board, the contact area between the heat plate 23 and the solder is increased. Consequently, heat is conducted well from the heat sink 23 through the solder to the conductor pattern and the heat generated from a pellet 22 can be dissipated well through the heat sink 23.;COPYRIGHT: (C)1999,JPO