Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

摘要

Yields on 5400and 54LS integrated circuits continue to improve as predicted. The exception is on a few lots where equipment problems or errors resulted in unsatisfactory results. Designs and design changes are reviewed on all of the integrated circuits. Yields on the discrete devices are still discouraging. However,the basic designs are good;only processing variations are of concern. It is believed that yields will improve as additional lots are processed during the confirmatory phase. (Author)