Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

摘要

Because of the number of integrated circuits processed to date,along with the favorable probe yield results,the 5400and 54LS processes have been well established. Results on the discrete devices,however,have not been as promising. Additional lots of each device type are being processed in an attempt at further improving yields. Packages for all of the devices have been designed for use in satisfying the qualification test requirements. (Author)