WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BONDABLE FINISH AND REDUCES BONDING PITCH ON SUBSTRATES

摘要

A semiconductor package and manufacturing method thereof are provided to reduce the package size and the wire length and to reduce the effective bond finger pitch for the wire bonding. The semiconductor package comprises the semiconductor die(14) arranged in the substrate(12). The bond wire connects the second bonding part with the first junction part(22). The second bonding part comprises the bond finger formed in the substrate, the conduction layer, and the bond stud. The conduction layer contacts physically the bond finger. The bond stud is physically combined with the conduction layer and the bond wire in the direct contact. The electric signal is delivered to the bond finger from the semiconductor die.