The application of Taguchi Design of Experiments (DOE) for optimizing wire bonding to thick film substrates.

摘要

his project focuses on the application of Taguchi Design of Experiments (DOE) to optimize wire bonding to thick film substrates commonly used in the manufacture of Hybrid microcircuits. This study was designed to identify the critical wire bonding variables that affect the bond pull strength of gold wires bonded to thick film surfaces.;The experimental strategy used for this study was a Taguchi L8 Orthogonal Array run at 2-levels. The factors investigated were Force, Time, and Power and their interactions--Force