SEMICONDUCTOR PACKAGE SUBSTRATE INCLUDING FUSES, SEMICONDUCTOR DEVICE PACKAGE, SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS INCLUDING THE SAME

摘要

A semiconductor device package, and a semiconductor module and an electronic apparatus including the semiconductor device package are provided. The semiconductor device package includes a package substrate, first pads and second pads disposed on a first surface of the package substrate and fuses corresponding to the second pads, the fuses being disposed on a second surface of the package substrate. First and second semiconductor chips including a plurality of chip pads are disposed on the first surface of the package substrate and the first pads are electrically connected to both one of the chip pads of the first semiconductor chip and one of the chip pads of the second semiconductor chip, wherein the second pads are selectively electrically connected to one of the chip pads of the first semiconductor chip or one of the chip pads of the second semiconductor chip.