Semiconductor Devices having a Redistribution Structure and Semiconductor Packages Package Stacked Structures Semiconductor Modules Electronic Circuit Boards and Electronic Systems including the Semiconductor Device and Methods of fabricating the Same

摘要

semiconductor element and the semiconductor package including a semiconductor element, a package stacked structure, a semiconductor module, an electronic circuit board and an electronic system, and a method of manufacturing the same with a re-wiring structure are described. Semiconductor device according to the spirit of the present invention includes a semiconductor chip including a semiconductor circuit therein, the chip pads formed on top of the semiconductor chip of the protective layer formed on the semiconductor chip, the rewiring insulating layer formed on the protective layer , and the protecting layer and the grown vertically through the wire insulation layer, the re-wiring via plug to be connected respectively to the chip pads and electrically, and is formed in the re-wiring insulating layer are electrically with the re-wiring via plug including re-wiring structure including a connection re-wiring line, and the re-wiring via plug and the re-wiring line may have the same upper surface level, it said at least one growing the at least one re-wiring and the lines via plug wiring It is formed integrally with the same material. ; re-wiring structure, the ink-jet gray photomask, laminated