SEMICONDUCTOR DEVICE WITH A REWIRING STRUCTURE, A SEMICONDUCTOR PACKAGE INCLUDING THE SAME, A PACKAGE LAMINATE STRUCTURE, A SEMICONDUCTOR MODULE, AN ELECTRONIC CIRCUIT BOARD, AN ELECTRONIC SYSTEM, AND MANUFACTURING METHODS THEREOF

摘要

PURPOSE: A semiconductor device with a rewiring structure, a semiconductor package including the same, a package laminate structure, a semiconductor module, an electronic circuit board, an electronic system, and manufacturing methods thereof are provided to improve yield through simple manufacturing processes.;CONSTITUTION: Chip pads are formed on the upper side of a semiconductor chip. A protection layer(730) is formed on the semiconductor chip. A rewiring insulation layer is formed on the protection layer. Rewiring via plugs(760v) are connected to a chip pad by vertically passing through the protection layer and the rewiring insulation layer. A rewiring structure(760) includes rewiring electrically connected to the rewiring via plugs. The upper surface height of the rewiring via plugs is equal to the upper surface height of the rewiring. At least one rewiring via plug is integrated to the rewiring using the same materials.;COPYRIGHT KIPO 2011