STACKED CHIP SEMICONDUCTOR PACKAGE USING A TSV STACKED ON A SUBSTRATE BY FLIP CHIP BONDING AND A WIRE

摘要

PURPOSE: A stacked chip semiconductor package using a TSV(Through Silicon Via) is provided to reduce the number of through silicon vias and simultaneously reduce a space where the TSV is formed, thereby increasing the space usability rate of a chip.;CONSTITUTION: A lower chip module(20) is electrically connected to a substrate(10) by flip chip bonding. The lower chip module includes a plurality of chips(22) with a TSV(52). A sub chip module(30) is stacked on the lower chip module. An upper chip module is electrically connected to a substrate by a wire(16). A heat spreader contacting a thermal via is attached onto the upper chip module.;COPYRIGHT KIPO 2011