机译:堆叠芯片和入口位置对3D堆叠倒装芯片封装封装中空隙形成的影响
School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang Malaysia;
School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang Malaysia;
School of Material and Mineral Resources, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia;
School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang Malaysia;
Void formation; 3D stacked flip-chip packaging; Virtual modeling; IC packaging; Castro-Macosko model;
机译:格子Boltzmann方法研究三维堆叠芯片封装对封装过程中微孔形成的影响
机译:在塑料封装过程中,通过硅通孔的3D集成电路封装中芯片堆叠效应的流固耦合分析
机译:垂直堆叠模具对堆叠式芯片级封装封装过程中环氧模塑化合物流动行为的影响
机译:3D堆叠倒装芯片封装过程中堆叠芯片的影响和流体/结构相互作用模拟
机译:3D堆叠芯片新兴技术的热感知优化
机译:基于离散空隙形成的倒装芯片焊点失效的电迁移机理
机译:采用光可定义聚酰亚胺和封装对称性的3D堆叠超薄芯片封装的高产量制造工艺