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Structural Optimization & Reliability of 3D Package by Studying Crack Behavior on TSV & BEOL & Impact of Power Cycling on Reliability Flip Chip Package

机译：三维封装的结构优化及可靠性研究TSV＆BEOL裂缝行为及功率循环对可靠性倒装芯片封装的影响

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作者
Rahangdale, Unique.;
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作者单位

The University of Texas at Arlington.;

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授予单位 The University of Texas at Arlington.;
学科
学位 M.S.M.E.
年度 2017
页码 91 p.
总页数 91
原文格式 PDF
正文语种 eng
中图分类 AAI13890406;
关键词
入库时间 2022-08-17 12:01:02

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1. Chip–Package Interaction and Reliability Improvement by Structure Optimization for Ultralow-$k$ Interconnects in Flip-Chip Packages [J] . Zhang X. Device and Materials Reliability, IEEE Transactions on . 2012,第2期

机译：倒装芯片封装中超低$ k $互连的结构优化改善了芯片-封装相互作用和可靠性
2. A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages [J] . Kyung-Woon Jang, Jin-Hyoung Park, Soon-Bok Lee, Microelectronics reliability . 2012,第6期

机译：薄板上芯片（COB）封装的各向异性导电膜（ACF）倒装芯片组件的热循环（T / C）可靠性研究
3. Reliability Impacts on Flip Chip Packages: Moisture Resistance, Mechanical Integrity and Photo-Sensitive Polyimide (PSPI) Passivation [J] . Kim Gun Rae, Ha Sang-Su, Pae Sangwoo, Science of advanced materials . 2020,第4期

机译：可靠性对倒装芯片封装的影响：耐湿性，机械完整性和光敏聚酰亚胺（PSPI）钝化
4. ENHANCING THE RELIABILITY OF 3D PACKAGE BY ANALYZING CRACK BEHAVIOR ON TSV THROUGH STRUCTURAL OPTIMIZATION AND COMPARING MATERIAL PROPERTIES OF THE PACKAGE [C] . Mehzabeen Kabir, ASM Raufur Chowdhury, Krishna Shivaraju, SMTA International Conference . 2020

机译：通过通过结构优化分析TSV的裂缝行为来增强3D封装的可靠性，并通过封装的材料特性进行比较
5. Chip package interaction (CPI) and its impact on the reliability of flip-chip packages. [D] . Zhang, Xuefeng. 2009

机译：芯片封装相互作用（CPI）及其对倒装芯片封装可靠性的影响。
6. Reliability and accuracy of three imaging software packages used for 3D analysis of the upper airway on cone beam computed tomography images [O] . Hui Chen, Maureen van Eijnatten, Jan Wolff, 2017

机译：在锥束计算机断层扫描图像上对上呼吸道进行3D分析的三种成像软件包的可靠性和准确性
7. Reliability of Flip Chip Package^^mdash;Thermal Stress on Flip Chip Joint^^mdash; [O] . Yutaka Tsukada 2013

机译：倒装芯片封装的可靠性^ ^ mdash;倒装芯片关节的热应力^ ^ mdash;
8. Reliability assessment of advanced flip-chip interconnect electronic package assemblies under extreme cold temperatures (-190 degrees C and -120 degrees C) [R] . Ramesham, Rajeshuni, Ghaffarian, Reza, Shapiro, Andrew, 2005

机译：极端低温（-190摄氏度和-120摄氏度）下高级倒装芯片互连电子封装组件的可靠性评估

Structural Optimization & Reliability of 3D Package by Studying Crack Behavior on TSV & BEOL & Impact of Power Cycling on Reliability Flip Chip Package

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