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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WAFER LEVEL RECONFIGURED MULTICHIP PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WAFER LEVEL RECONFIGURED MULTICHIP PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
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机译:具有晶圆级重配置多芯片封装系统的集成电路封装系统及其制造方法
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摘要
A method of manufacture of an integrated circuit packaging system includes: removing a portion of a leadframe to form a partially removed region and an upper portion of a peripheral lead on the leadframe first side; mounting a first integrated circuit over the partially removed region with a first adhesive; forming a first molding layer directly on the first integrated circuit and the peripheral lead; removing a portion of a leadframe second side exposing the first adhesive; mounting a second integrated circuit on the first adhesive of the first integrated circuit; forming a first interconnection layer directly on the first integrated circuit with the first integrated circuit and the peripheral lead electrically connected; and forming a second interconnection layer directly on the second integrated circuit with the second integrated circuit and the peripheral lead electrically connected.
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