Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies

摘要

Recent advances in silicon semiconductor technology with transit and maximum oscillation frequencies above 300 GHz have enabled the integration of complex transceiver front ends operating in the millimeter-wave (mmW) regime for a variety of applications. Among these, the most prominent frequency ranges (and their associated applications) are currently the 60-GHz short-range communication frequency band [1]-[2] and E-band wireless back-haul solutions [3]-[4], as well as the 76-81-GHz band for automotive radar sensor realizations [5]-[6].