Fan-out type wafer-level grating package and method of manufacturing a fan-out type wafer-level grating package

摘要

In various aspects of the disclosure, a chip package assembly may be provided. The chip package assembly may include a dielectric layer (115) having at least one die (401) adjacent the dielectric layer (115), at least one bonding pad on the die (401), the bonding pad exposed through the dielectric layer (115) first material comprising a first thermal expansion coefficient substantially surrounding the die (401) and adjacent to the dielectric layer (115) a second material having a second thermal expansion coefficient substantially surrounding the die (401) and the first material; and at least one conductive trace (320) electrically connected to the die (401).