Manufacturing Methods for a Multifunction Integrated Circuit Package.

摘要

The purpose of the program was to develop a radiation resistant,hermetically sealed,integral lead package,capable of packaging and interconnecting a number of 'state-of-the-art' uncased integrated circuits. A ceramic laminated multilayer package bases having two buried layers, a system of connecting vias, a solder seal ring and 55leads was designed. More than 100substrate package bases were processed in an engineering pilot line and time and yield data taken through each step. Evaluation tests on completed circuits were performed per MIL-STD-750,and a number of radiation tests were made on operational and mechanical circuits. (Author)