CHIP-ON WAFER BONDING METHOD AND BONDING DEVICE AND STRUCTURE INCLUDING CHIP AND WAFER

摘要

PROBLEM TO BE SOLVED: To provide a technique for enhancing mechanical strength by establishing electrical connection between a chip and a wafer or between a plurality of stacked chips, and for bonding a chip onto a wafer efficiently.;SOLUTION: The method for bonding a chip-on wafer includes: step S1 for performing surface activation at least of a metal area of a chip side bonding surface by colliding particles having a predetermined kinetic energy, and hydrophilizing by depositing water or an OH-containing material; step S2 for performing surface activation at the bonding part of a substrate by colliding particles having a predetermined kinetic energy, and hydrophilizing by depositing water or an OH-containing material; step S3 for attaching a plurality of chips subjected to surface activation and hydrophilization, respectively, onto the corresponding bonding parts of the substrate subjected to surface activation and hydrophilization so that the metal area of the chip comes into contact with the bonding part of the substrate; and step S4 for heating a structure including the substrate and the plurality of chips attached onto the substrate.;COPYRIGHT: (C)2014,JPO&INPIT