The Evolution of Wafer Bonding Moving from the back-end further to the front-end

摘要

@@ 1 IntroductionrnAs the nanoscale era progresses, innovative new materials and processes continue to be developed and implemented as a means of keeping the industry on the path of Moore's Law. Wafer bonding - literally, the temporary or permanent joining of two wafers or substrates using a suitable combination of process technologies, chemicals and adhesives - is one such innovation.