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Mitigation Techniques for Single-Event-Induced Charge Sharing in a 90-nm Bulk CMOS Process

机译:90 nm体CMOS工艺中单事件引起的电荷共享的缓解技术

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摘要

In this paper, mitigation techniques to reduce the increased SEU cross section associated with charge sharing in a 90-nm dual-interlocked-cell latch are proposed. The increased error cross section is caused by heavy-ion angular strikes depending on the direction of the ion strike, thereby exacerbating charge sharing among multiple circuit nodes. The use of nodal spacing as a mitigation technique shows an order of magnitude decrease on upset cross section as compared to a conventional layout, and the use of guard-rings show no noticeable effect on upset cross section.
机译:在本文中,提出了缓解技术,以减少与90nm双互锁单元锁存器中的电荷共享相关的增大的SEU截面。误差横截面的增加是由重离子角撞击(取决于离子撞击的方向)引起的,从而加剧了多个电路节点之间的电荷共享。与传统的布局相比,使用节距作为缓解技术显示出up粗横截面的数量级减少,并且保护环的使用对up粗横截面没有明显的影响。

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