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Pulse quenching based radiation-hardened by design technique for analog single-event transient mitigation on an operational amplifier in 28 nm bulk CMOS process

机译:脉冲淬火基于28 nm批量CMOS过程的模拟单事件瞬态缓解模拟单事件瞬态缓解的辐射硬化

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In nanometer bulk CMOS processes, multi-node charge collection induced by a heavy-ion strike is prevalent. Pulse quenching caused by charge sharing between the struck node (termed as active device) and the following gate (termed as passive device) has been widely studied in digital circuits. This paper firstly demonstrates that the pulse quenching effect also exists between the adjacent stages of analog circuits and can be used to mitigate analog single-event transient (ASET) perturbation. Contrary to digital circuits, whose propagated SET is minimized with the charge collected by passive device maximized, simulation results indicate that there is an optimal spacing between the active and passive devices in analog circuits. When the spacing is too close, the SET induced by the hit node is efficiently mitigated by pulse quenching effect, but the disturbance caused by the charge sharing collection in passive device becomes dominant. Simulation results show that pulse quenching effect has a dual role in ASET mitigation. This paper provides innovative guidance to the radiation-hardening design for analog circuits.
机译:在纳米批量CMOS过程中,由重离子冲击引起的多节点电荷收集是普遍的。在数字电路中广泛地研究了由击球节点(称为有源器件)和以下门(称为无源器件)之间的电荷共享引起的脉冲淬火。本文首先表明脉冲淬火效果也存在于模拟电路的相邻阶段之间,并且可用于减轻模拟单事件瞬态(ASET)扰动。与数字电路相反,其传播的设定被通过被动装置收集的电荷最大化,模拟结果表明模拟电路中的主动和无源器件之间存在最佳间隔。当间距太近时,由脉冲淬火效果有效地减轻由命中节点引起的设定,但是被动装置中的电荷共用收集引起的扰动变得优势。仿真结果表明,脉冲淬火效应在ASET缓解中具有双重作用。本文为模拟电路的辐射硬化设计提供了创新指导。

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