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Universal MOSFET hole mobility degradation models for circuit simulation

机译:用于电路仿真的通用MOSFET空穴迁移率降低模型

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Universal, semi-empirical MOSFET hole inversion layer mobility degradation models for use in circuit simulation programs such as SPICE are presented. By accurately predicting the mobility degradation due to acoustic phonon scattering and surface roughness scattering for p-channel MOSFETs at room temperature, these models eliminate the need for fitting parameters for each technology, which is required in the current SPICE level 3 model. The expressions reported accurately predict the mobility over a very wide range of channel doping concentrations, gate oxide thicknesses, gate voltage, and substrate bias, and they agree very well with recently published experimental mobility degradation data. When implemented in a circuit simulation code, these models will accurately determine the channel mobility in surface p-channel MOSFETs using only the channel doping concentration, gate oxide thickness, substate bias, and applied gate drive voltage as input parameters.
机译:提出了用于电路仿真程序(例如SPICE)的通用半经验MOSFET空穴反转层迁移率退化模型。通过准确预测室温下p沟道MOSFET的声子散射和表面粗糙度散射引起的迁移率降低,这些模型消除了对每种技术的拟合参数的需求,这是当前SPICE 3级模型所要求的。报告的表达式可准确预测在很宽范围的沟道掺杂浓度,栅极氧化物厚度,栅极电压和衬底偏压范围内的迁移率,并且与最近发表的实验迁移率退化数据非常吻合。当在电路仿真代码中实现时,这些模型将仅使用沟道掺杂浓度,栅极氧化物厚度,子状态偏置和施加的栅极驱动电压作为输入参数,即可准确确定表面p沟道MOSFET中的沟道迁移率。

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