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首页> 外文期刊>IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems >Improved universal MOSFET electron mobility degradation models for circuit simulation
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Improved universal MOSFET electron mobility degradation models for circuit simulation

机译:改进的通用MOSFET电子迁移率退化模型用于电路仿真

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摘要

Based on the physical insights provided by the universal mobility curve, an improved comprehensive universal model for effective electron mobility in inversion layers of n-channel MOSFETs is developed for circuit simulation. This model expresses the effective electron mobility at room temperature as a function of effective vertical field. It exhibits a high degree of accuracy for a wide range of different device characteristics, such as channel doping levels, gate oxide thicknesses, and channel dimensions. In addition, it predicts very well the effective mobility under the effects of substrate biases for gate voltages well above threshold, which is an improvement over earlier models. Moreover, this model has been developed with an emphasis on the functional dependence of mobility on high effective field, and is thus particularly accurate in that range of effective field. This is a significant advantage of the model since today's submicrometer MOSFETs typically operate at high effective fields.
机译:基于通用迁移率曲线提供的物理见解,开发了一种改进的通用通用模型,用于n沟道MOSFET的反型层中的有效电子迁移率,用于电路仿真。该模型将室温下的有效电子迁移率表示为有效垂直场的函数。对于各种不同的器件特性(例如沟道掺杂水平,栅氧化层厚度和沟道尺寸),它具有很高的精度。另外,它很好地预测了栅极电压远高于阈值的衬底偏置效应下的有效迁移率,这是对早期模型的改进。此外,该模型的开发着重于迁移率对高效场的功能依赖性,因此在该有效场范围内特别准确。这是该模型的显着优势,因为当今的亚微米MOSFET通常在高效电场下工作。

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