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A mobility model for submicrometer MOSFET simulations including hot-carrier-induced device degradation

机译:亚微米MOSFET模拟的迁移率模型,包括热载流子引起的器件退化

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The model presented includes the quantum effects of electrons in the inversion layer proposed by S.A. Schwarz and S.E. Russek (1983) and the surface scattering effects due to the interfacial charges. By comparison with experimental data from scaled MOSFETs, the limitation of K. Yamaguchi's (1983) mobility model in submicrometer device simulations is implied, while the quantum channel broadening effects have been proven significant in turn. In addition, it is shown that the modeling of the screening effect of Coulomb scattering plays an important role in simulating the hot-carrier-induced MOSFET degradation. The model can predict the current-voltage characteristics within 5% accuracy for scaled MOSFETs down to 0.5- mu m, as well as the degradation of electrical characteristics due to hot-carrier effects for submicrometer MOSFETs.
机译:提出的模型包括S.A. Schwarz和S.E.提出的反型层中电子的量子效应。 Russek(1983)和由于界面电荷引起的表面散射效应。通过与规模化MOSFET的实验数据进行比较,暗示了K. Yamaguchi(1983)迁移率模型在亚微米器件仿真中的局限性,而量子通道的扩宽效应反过来又被证明是重要的。此外,表明库仑散射屏蔽效应的建模在模拟热载流子引起的MOSFET退化中起着重要作用。该模型可以预测小至0.5μm的MOSFET的电流-电压特性在5%的精度范围内,以及亚微米MOSFET的热载流子效应导致的电特性下降。

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