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Consistent model for the hot-carrier degradation in n-channel and p-channel MOSFETs

机译:n沟道和p沟道MOSFET中热载流子退化的一致模型

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A model is derived using the charge-pumping technique for the evaluation of the interface characteristics, in combination with the behavior of the drain and the substrate currents after degradation. For n-channel transistors the degradation is mainly caused by the generation of interface traps. Only in the region of hole injection (V/sub g/ approximately=V/sub t/) is the degradation dominated by the trapped holes, which mask the effect of the generated interface traps. The degradation of p-channel transistors, although completely different at first sight, occurs by the same mechanisms. For this case, the degradation is caused by trapped negative charge, which masks the influence of the interface traps. The latter are nevertheless generated in comparable amounts as in n-channel transistors. Based on these insights, improved procedures for accelerated-lifetime experiments are proposed for both channel types. Finally, the peculiar degradation behavior of n-channel transistors under alternating injection conditions is discussed and fully explained based on the static stress degradation model.
机译:利用电荷泵技术,结合退化后的漏极行为和衬底电流,推导出了用于评估界面特性的模型。对于n沟道晶体管,性能下降主要是由界面陷阱的产生引起的。仅在空穴注入区域(V / sub g /大约等于V / sub t /),降解才被捕获的空穴所控制,这掩盖了所产生的界面陷阱的作用。尽管乍看之下p沟道晶体管的性能完全不同,但其退化是由相同的机制引起的。对于这种情况,降解是由捕获的负电荷引起的,该电荷掩盖了界面陷阱的影响。但是,后者的产生量与n沟道晶体管相当。基于这些见解,针对这两种通道类型,提出了改进的加速寿命实验程序。最后,基于静态应力退化模型,讨论并充分解释了交替注入条件下n沟道晶体管的特殊退化行为。

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