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A model for AC hot-carrier degradation in n-channel MOSFETs

机译:n沟道MOSFET中AC热载流子退化的模型

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摘要

A recently developed model for AC hot-carrier lifetimes is shown to be valid for typical and worst-case stress waveforms found in CMOS circuits. Three hot-carrier damage mechanisms are incorporated into the model: interface states created at low and medium gate voltages, oxide electron traps created at low gate voltages, and oxide electron traps created at high gate voltages. It is shown that the quasi-static contributions of these three mechanisms fully account for hot-carrier degradation under inverterlike AC stress. No transient effects are required to explain AC stress results, at least for frequencies up to 1 MKz.
机译:事实表明,最近开发的交流热载流子寿命模型对于CMOS电路中典型的和最坏情况的应力波形均有效。该模型包含了三种热载流子损坏机制:在低和中等栅极电压下产生的界面状态,在低栅极电压下产生的氧化物电子陷阱和在高栅极电压下产生的氧化物电子陷阱。结果表明,这三种机制的准静态贡献完全说明了在类似逆变器的交流应力下热载流子的退化。至少对于1 MKz以下的频率,不需要瞬变效应来解释AC应力结果。

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