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On the profile design and optimization of epitaxial Si- and SiGe-base bipolar technology for 77 K applications. II. Circuit performance issues

机译:关于用于77 K应用的外延Si基和SiGe基双极技术的轮廓设计和优化。二。电路性能问题

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For pt.I see ibid., vol.40, no.3, p.525-41 (1993). The circuit performance issues associated with optimizing epitaxial Si- and SiGe-base bipolar technology for the liquid-nitrogen temperature environment are examined in detail. It is conclusively demonstrated that the notion that silicon-based bipolar circuits perform poorly at low temperatures is untrue. Transistor frequency response is examined both theoretically and experimentally, with particular attention given to the differences between SiGe and Si devices as a function of temperature. ECL and NTL ring oscillator circuits were fabricated for each of the four profiles described in pt.I. The minimum ECL gate delay for a SiGe base is essentially unchanged from its room-temperature value. ASTAP models were used to explore circuit operation under typical wire loading. The results indicate that epitaxial-base bipolar technology offers significant leverage for future cryogenic applications.
机译:关于第一部分,见同上,第40卷,第3期,第525-41页(1993年)。详细研究了与针对液氮温度环境优化外延硅基和硅锗基双极技术相关的电路性能问题。最终证明基于硅的双极电路在低温下性能较差的说法是不正确的。晶体管的频率响应在理论上和实验上都得到了检验,并特别注意了SiGe和Si器件之间的差异随温度的变化。为pt.I中描述的四个曲线分别制作了ECL和NTL环形振荡器电路。 SiGe基极的最小ECL栅极延迟与其室温值基本保持不变。 ASTAP模型用于探讨典型电线负载下的电路操作。结果表明,基于外延的双极技术为未来的低温应用提供了重要的杠杆作用。

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