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Low-frequency noise characteristics of UHV/CVD epitaxial Si- and SiGe-base bipolar transistors

机译:UHV / CVD外延Si和SiGe基双极晶体管的低频噪声特性

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We report the first measurements of low-frequency noise in high-performance, UHV/CVD epitaxial Si- and SiGe-base bipolar transistors. The magnitude of the noise power spectral density at fixed frequency for both Si and SiGe devices is comparable for similar bias, geometry, and doping conditions, indicating that the use of strained SiGe alloys does not degrade transistor noise performance. The best recorded values of noise corner frequency were 480 Hz and 373 Hz for the Si and SiGe transistors, respectively, for multi-stripe devices with an emitter area of 0.5/spl times/10.0/spl times/3 /spl mu/m/sup 2/. A functional dependence of the noise power spectral density on base current for both device types of I/sub B//sup 1.90/ was observed, and noise measurements as a function of device geometry suggest that the contributing noise sources are uniformly distributed across the emitter of the transistors, not at the emitter periphery.
机译:我们报告了高性能,UHV / CVD外延Si和SiGe基双极晶体管中低频噪声的首次测量。对于类似的偏置,几何形状和掺杂条件,Si和SiGe器件在固定频率下的噪声功率谱密度的大小是可比的,这表明使用应变SiGe合金不会降低晶体管的噪声性能。对于发射极面积为0.5 / spl倍/10.0/spl倍/ 3 / spl mu / m /的多条纹器件,Si和SiGe晶体管的最佳噪声角频率记录值分别为480 Hz和373 Hz。 sup 2 /。对于I / sub B // sup 1.90 /的两种器件类型,噪声功率谱密度对基础电流的函数依赖性都得到了观察,并且噪声测量值随器件几何形状的变化表明,贡献的噪声源在发射器上均匀分布而不是在发射极外围。

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