首页> 外文期刊>IEEE Transactions on Electron Devices >New aspects and mechanism of kink effect in static back-gate transconductance characteristics in fully-depleted SOI MOSFETs on high-dose SIMOX wafers
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New aspects and mechanism of kink effect in static back-gate transconductance characteristics in fully-depleted SOI MOSFETs on high-dose SIMOX wafers

机译:大剂量SIMOX晶圆上的全耗尽SOI MOSFET静态背栅跨导特性中的纽结效应的新方面和机理

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An extraordinary kink phenomenon in static back-gate transconductance characteristics of fully-depleted SOI MOSFETs has been experimentally investigated and characterized for the first time. This kink phenomenon has been observed in both NMOS and PMOS on high-dose SIMOX wafers under steady-state conditions at room temperature. It was also found that the back-gate characteristics for both NMOS and PMOS show anomalous shift phenomenon in drain current-back gate voltage (I/sub D/-V/sub G2/) curve at the back-gate voltage corresponding to the kink phenomenon. This kink phenomenon has been attributed to the presence of energetically-localized trap states at SOI/BOX interface. In order to clarify the energy level of the trap states at SOI/BOX interface corresponding to the kink, we have developed a new formula of surface potential in thin-film SOI MOS devices, in which the potential drop across semiconductor-substrate is taken into account. By using this new formula, me have demonstrated that high-dose SIMOX wafers have donor-like electron trap states at /spl sim/0.33 eV above the Si midgap with the density of /spl sim/N6.0/spl sim/10/sup 12/ cm/sup -2/ eV/sup -1/ and donor-like hole trap states at /spl sim/0.35 eV below the Si midgap with density of /spl sim/1.5/spl times/10/sup 12/ cm/sup -2/ eV/sup -1/ at SOI/BOX interface.
机译:首次对全耗尽SOI MOSFET的静态背栅跨导特性中的异常扭结现象进行了实验研究并进行了首次表征。在室温下,在稳态条件下,在大剂量SIMOX晶片上的NMOS和PMOS中都观察到了这种扭结现象。还发现,在对应于扭结的背栅电压下,NMOS和PMOS的背栅特性在漏极电流-背栅电压(I / sub D / -V / sub G2 /)曲线中均显示出异常移位现象。现象。这种扭结现象已归因于在SOI / BOX接口处存在能量局部陷阱态。为了阐明对应于纽结的SOI / BOX界面处陷阱态的能级,我们开发了薄膜SOI MOS器件中表面电势的新公式,其中将跨半导体衬底的电势降考虑在内帐户。通过使用这个新公式,我证明了高剂量SIMOX晶片在高于Si中能隙的/ spl sim / 0.33 eV处具有/ spl sim / N6.0 / spl sim / 10 /密度的类施主电子陷阱态。 sup 12 / cm / sup -2 / eV / sup -1 /和Si中间能隙以下/ spl sim / 0.35 eV处的供体状空穴陷阱状态,密度为/ spl sim / 1.5 / spl次/ 10 / sup 12 /在SOI / BOX接口处为cm / sup -2 / eV / sup -1 /

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