塑料封装集成电路分层浅析及改善研究

摘要

When the environmental temperature, humidity change, plastic packaging integrated circuit internal different material interface will produce the delamination, delam cause circuit loop open or intermittent bad contact, greatly affect the function of the IC and service life.Packaging BOM (such as:chip/frame/epoxy/resin ) is to determine IC MSL level and delam level of basic, assembly process design, process control method, product to prevent external force damage and thermal stress protection are influencing factors of delamination, BOM combination need to consider the strength between reinforcing material and close to the modulus of thermal expansion, design the chip PO layer reduce the circuit surface concave-conve, frame groove and convex platform design, manufacturing process pollution prevention/anti-oxidation control, etc., are all improve IC products internal delamination effective ideas. DOE is helpful to the complex manufacturing process found the root causes of delamination.%　　当环境温度、湿度发生变化时,塑料封装集成电路内部的不同物质界面会产生分层,分层导致电路回路的开路或间歇性接触不良,极大地影响IC的功能和使用寿命.封装主要材料BOM(如芯片/框架/装片胶/塑封料环氧树脂)是确定IC MSL等级和分层水平的基础,封装制程的工艺设计、组装过程的控制方法、产品防范外力破坏及热电应力防护都是影响分层的因素,BOM组合需要考虑加强材料间的粘结强度及接近的热膨胀系数、设计芯片PO层减少电路表面凹凸落差、框架沟槽凸台设计、制造过程防污染/防氧化控制等,都是改善IC产品内部分层的有效思路.DOE对比试验有助于从复杂的产品制造过程中发现分层产生的根源.