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LOADING RATE EFFECT INVESTIGATION OF THROUGH-HOLE-MOUNTED SOLDER JOINTS

机译:装载速率效应调查通孔焊接接头

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摘要

This paper presents two simple and unique tests to extract shock-level loading limits for eutectic and lead free solders. A wide range of loading rates, from quasi-static to high speed, was applied to a through-hole-mounted anchor assembly test coupon. The high speed shock tests were conducted on a drop shock table where the impacting velocities were derived through table input adjustments. The quasi-static tests were done using controlled hydraulic linear actuator with a load cell. As would be assumed, the dynamic load to cause solder joint failure was found to increase with higher loading rate. However, at such a high loading rate range, the impact velocity did not change the load to failure. This study leads to an interesting hypothesis that at high loading rates, the solder joint strain rate may not see a significant change as observed at low rates.
机译:本文提出了两种简单而独特的测试,以提取共晶和无铅焊料的冲击水平载荷限制。从准静态到高速的各种装载速率应用于通孔安装的锚固组件测试优惠券。高速冲击试验是在落叶表上进行的,其中通过表输入调整导出撞击速度。使用具有负载电池的受控液压线性致动器进行准静态试验。如将假设,发现导致焊接接头失效的动态负载随着较高的负载率而增加。然而,在这种高负载率范围内,冲击速度没有将负载变为故障。该研究导致有趣的假设,在高负荷率下,焊点应变速率可能看不到以低速率观察到的显着变化。

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