COMBINATION SPECIMENS FOR INVESTIGATING THE PROCESSES OF SOLDER FLOWING INTO A VARIABLE CAPILLARY GAP AND THE QUALITY OF SOLDERED JOINTS

• 1. 一种弹簧线圈焊点助焊剂间隙涂覆装置 [P] . 中国专利： CN215744572U . 2022-02-08
• 2. 助焊剂组合物、焊膏组合物和焊点 [P] . 中国专利： CN110536771A . 2019-12-03
• 3. COMPOSITION OF FILLER FOR NON-CAPILLARY SOLDERING GAPS AT AUTOVACUUM SOLDERING OF STEEL [P] . SU967744A1 . 1982-10-23

  机译： 钢的自动真空熔合非毛细熔合间隙填充剂的组成

• 4. PROCESSES FOR FORMING SELF-HEALING SOLDER JOINTS AND REPAIR OF SAME, RELATED SOLDER JOINTS, AND MICROELECTRONIC COMPONENTS, ASSEMBLIES AND ELECTRONIC SYSTEMS INCORPORATING SUCH SOLDER JOINTS [P] . US2021193607A1 . 2021-06-24

  机译： 形成自愈合焊接接头和固定的方法，相同的相关焊点和微电子元件，组件和电子系统，包括这种焊点

• 5. METHOD OF MANUFACTURING A SPECIMEN FOR INVESTIGATING MECHANICAL PROPERTIES OF SOLDERED JOINTS OF DISSIMILAR MATERIALS [P] . SU1755095A1 . 1992-08-15

  机译： 制造用于研究异种材料的焊接接头力学性能的样本的方法

• 1. Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology [J] . HAN Zong-jie, XUE Song-bai, WANG Jian-xin, 中国有色金属学报（英文版） . 2008,第004期
• 2. Capillary wave formation on excited solder jet and fabrication of lead-free solder ball [J] . ZHANG Shu-guang, HE Li-jun, ZHU Xue-xin, 中国有色金属学报（英文版） . 2005,第005期
• 3. ZnO whiskers growth on the surface of Sn9 Zn/Cu solder joints in concentrator silicon solar cells solder layer [J] . Zhang Liang, Yang Fan, Zhong Sujuan 高技术通讯（英文版） . 2017,第003期
• 4. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际, 光华, 盛光敏, 中南大学学报（英文版） . 2016,第008期
• 5. An investigation of reliability and solder joint microstructure evolution of select Pb-free FCBGA pad finish and solder ball alloy combinations [C] . Cavasin, Daniel ECTC 2010;Electronic Components and Technology Conference . 2010
• 6. The role of soldering process variables on properties of lead-free solder joints. [D] . Rowley, Jonathan Gabriel. 2003
• 7. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint [O] . Sang-Yeob Lee, Jong-Hyuk Lee 2010
• 8. Erratum to: Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints [O] . Shengfa Liu, Zhebing Hu, Jieran Xiong, 2017
• 9. Inelastic Strain Analysis of Solder Joint in NASA Fatigue Specimen [R] . Dasgupta, A., Oyan, C. 1991

• 1. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际12 ,文光华1 ,盛光敏1 . 中南大学学报 . 2016,第008期
• 2. 焊剂带约束电弧超窄间隙焊接方法应用于钢轨的焊接 [C] . 龚练 ,朱亮 ,杨韬君 . 第二十次全国焊接学术会议 . 2015
• 3. 微电子焊接助焊剂及其焊点组织研究 [A] . 李树丰 . 2005