High-Speed Camera Investigation into Fracture Behavior of Solder Ball Joints Under Dynamic Loading

摘要

The mechanical integrity of solder ball joints under dynamic loading is generally evaluated by means of a JEDEC standard impact test at high speed (0.01-1 m/s). Such tests result in a higher incidence of interfacial fracture than low-speed shear tests, and provide valuable insights into the load-displacement response and failure mode of the solder ball joint. This study proposes an experimental technique for observing the interfacial fracture phenomenon by means of a high-speed framing camera that captures approximately 500,000 frames per second (fps). It is shown that by selecting an appropriate frame rate (78,212 fps), the resulting sequence of images provides a useful understanding of the manner in which the fracture originates, propagates, and leads to various types of failure mode, such as interfacial and bulk solder cracks.