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Structure of the breakdown spot during progressive breakdown of ultra-thin gate oxides

机译:超薄栅极氧化物逐步崩溃期间击穿斑点的结构

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It has been recently shown that the progressive breakdown (BD) is the dominant BD mode under operating conditions in CMOS circuits. Progressive BD at operating voltages can be very slow,with respect to the conditions of standard accelerated tests. It may take many years to reach gate leak-age levels large enough to appreciably disturb the circuit operation. The disturb level depends on the post-BD gate oxide conductance. For example, in an SRAM cell, to lose the noise margin for correct operation, BD spot resistances below about 50 k/spl Omega/ have to be reached. To correctly predict the behavior of a circuit with one or more transistors in BD, it is important to have an accurate model of the conduction through the BD spot during progressive BD. For a correct modeling it is, in turn, necessary to determine the physical structure of the BD spot. We have focused our study on trying to determine this structure during progressive BD. Based on this analysis we propose a quantitative model of post-BD conductance. hi this paper we present the main results of this activity.
机译:最近已经表明,渐进式故障(BD)是CMOS电路的操作条件下的主要BD模式。关于标准加速测试的条件,操作电压下的Progressive BD可以非常慢。可能需要多年的时间才能达到足够大的栅极泄漏年龄水平,以明显干扰电路操作。干扰水平取决于BD后栅极氧化物电导。例如,在SRAM单元中,为了丢失正确操作的噪声裕度,必须达到约50k / splω/ splω的BD光斑电阻。为了正确地预测BD中具有一个或多个晶体管的电路的行为,重要的是在渐进式BD期间通过BD点具有传导的准确模型。对于正确的建模,反过来是确定BD斑点的物理结构所必需的。我们专注于试图在逐步BD期间确定这种结构的研究。基于该分析,我们提出了BD后电导的定量模型。嗨,本文我们提出了这项活动的主要结果。

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