首页> 外文会议>International Symposium on VLSI Technology, Systems and Applications >High performance PMOS with strained high-Ge-content SiGe fins for advanced logic applications
【24h】

High performance PMOS with strained high-Ge-content SiGe fins for advanced logic applications

机译:高性能PMOS,带有应变高Ge含量的SiGe鳍,适用于高级逻辑应用

获取原文

摘要

FinFETs with strained-SiGe channel have recently drawn significant attention due to their built in uniaxial strain, higher mobility and better reliability over conventional Si FETs. Research on pure Ge has been the major focus of many institutes over the past few years. However, with high-Ge-content (HGC) SiGe one can benefit from competitive or better performance over pure Ge and overcome the thermal budget constraints required for Ge. In this paper, we briefly review our latest advancements in high-Ge-content strained-SiGe FinFETs featuring gate first and Replacement HK/MG (RMG) flows with record mobility and short-channel performance to extend the roadmap for advanced FinFET and FDSOI generations.
机译:具有应变SiGe沟道的FinFET由于其内置的单轴应变,更高的迁移率和比传统Si FET更好的可靠性,最近引起了广泛的关注。在过去的几年中,纯Ge的研究一直是许多研究所关注的重点。但是,使用高Ge含量(HGC)的SiGe可以比纯Ge具有竞争性或更好的性能,并且可以克服Ge所需的热预算约束。在本文中,我们简要回顾了我们在高锗含量应变SiGe FinFET中的最新进展,该技术具有先栅极和替代HK / MG(RMG)流量,并具有创纪录的迁移率和短通道性能,从而为高级FinFET和FDSOI世代扩展了路线图。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号