首页> 外文会议>Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on >Characterisation of reliability of compound semiconductor devices using electrical pulses
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Characterisation of reliability of compound semiconductor devices using electrical pulses

机译:使用电脉冲表征化合物半导体器件的可靠性

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Transmission line pulses (TLP) with 0-60V amplitude and 100ns pulse width have been applied for accelerated lifetime tests of GaAs devices. 1/f noise, RF noise and I/V measurements are applicable for the characterisation of the reliability of these devices. Different failure mechanisms can be identified by applying square pulses of varying amplitude and different polarity on a variety of samples. Correlation between anomalies in 1/f noise, RF noise and I/V characteristics has been determined. Using this novel method, the determination of failure threshold levels for current density, electric field and charge carrier temperature is possible and critical spots in device design can be ascertained.
机译:具有0-60V振幅和100ns脉冲宽度的传输线脉冲(TLP)已用于GaAs器件的加速寿命测试。 1 / f噪声,RF噪声和I / V测量适用于表征这些设备的可靠性。通过在各种样本上施加振幅变化和极性不同的方波脉冲,可以识别出不同的故障机制。已经确定了1 / f噪声,RF噪声和I / V特性异常之间的相关性。使用这种新颖的方法,可以确定电流密度,电场和载流子温度的故障阈值水平,并可以确定器件设计中的关键点。

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