Abstract: This paper presents and discusses experimental results which successfully demonstrate using flip-chip techniques, the bonding and operation of a GaAs edge emitting laser on a silicon substrate having recessed bonding pads. The flip chip alignment and bonding technique is discussed first, focusing on experimental results for both flux and flux-less forms of solder bump processing, the developed flux-less technique is shown to provide comparable solder bump integrity and yield. Subsequent to the newly developed solder bump fabrication methodology shown, a recessed bonding pad design is introduced and demonstrated experimentally to aid in the final coarse alignment and assembly of the GaAs laser device onto a silicon substrate. Together both the flux-less solder bump and bonding pad recess design and fabrication processes provide increased reliability for integration with MEMS and MOEMS based devices and systems over traditional methods for hybrid device attachment. !10
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