Process for fixing a semiconductor device on a switching device, used in flip-chip technology, comprises preparing a semiconductor device with bond pads on one surface

摘要

Process for fixing a semiconductor device (B) on a switching device (S), comprises preparing a semiconductor device with bond pads on one surface. Process for fixing a semiconductor device (B) on a switching device (S) comprises: (1) preparing a semiconductor device with bond pads on one surface and a switching device with electrical contact surfaces (KF) on the surface facing the semiconductor device; (2) forming base bodies (GK) for fixing elements and for flexible contact elements (FK) made from elastic plastic by applying plastic on the semiconductor device using a mask and hardening; (3) forming the flexible contact elements by metallizing the bumps of the base bodies; (4) forming conducting pathways (LK) between the metallized bumps and the corresponding bond pads of the semiconductor device; (5) arranging the semiconductor device and the switching device toward each other; (6) pressing the flexible contact elements of the semiconductor device onto the contact surfaces of the switching device; and (7) connecting the fixing elements with the opposite lying surface in a buckled state with the flexible contact elements An Independent claim is also included for a device produced by the above process.