Contact resistance of the micro bumps in a typical TSV structure

摘要

Contact resistance of the micro bumps in a PBGA (Plastic Ball Grid Array) packaging with TSV (Through Silicon Via) structure was characterized in this study. To this end, a self-designed TSV daisy chain circuit was proposed as the measurement paths and the test samples were made with commercialized packaging process to simulate real product behavers. Based on circuit model analysis, contact resistance for the micro bump were extracted from a systematic experimental design and measurement.