机译:通过优化电镀材料的机械性能以及TSV和细小凸块的对准结构,使3D倒装芯片结构中的局部残余应力最小化
Department of Nanomechanics,Graduate School of Engineering,Tohoku University,6-6-11-716, Aoba Aramaki, Aobaku, Sendai,Miyagi 980-8579, Japan;
Department of Nanomechanics,Graduate School of Engineering,Tohoku University,6-6-11-716, Aoba Aramaki, Aobaku, Sendai,Miyagi 980-8579, Japan;
Department of Nanomechanics,Graduate School of Engineering,Tohoku University,6-6-11-716, Aoba Aramaki, Aobaku, Sendai,Miyagi 980-8579, Japan;
Fracture and Reliability Research Institute,Graduate School of Engineering,Tohoku University,6-6-11-716, Aoba Aramaki, Aobaku, Sendai,Miyagi 980-8579,Japan;
Fracture and Reliability Research Institute,Graduate School of Engineering,Tohoku University,6-6-11-716, Aoba Aramaki, Aobaku, Sendai,Miyagi 980-8579,Japan;
机译:测量3D倒装芯片结构中细小金属凸块之间的局部残余应力
机译:倒装芯片焊点中凸点冶金条件下电镀镍铜合金的残余应力和界面反应
机译:模版印刷法Sn-0.7Cu倒装焊锡凸块的组织和力学性能
机译:通过优化电镀材料的机械性能以及TSVS和微凸点的对齐结构来最小化3D倒装芯片结构中的局部残余应力
机译:三维封装的结构优化及可靠性研究TSV&BEOL裂缝行为及功率循环对可靠性倒装芯片封装的影响
机译:具有热残余应力效应的复合材料和结构棘轮行为的均质化和局域化
机译:区域阵列倒装芯片封装结构中的凸块接头的非破坏性检查系统(<特殊问题>电子设备和机械工程机械可靠性)