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机译:测量3D倒装芯片结构中细小金属凸块之间的局部残余应力
Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579, Japan;
Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579, Japan;
Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579, Japan;
Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579, Japan;
Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University, 6-6-11-712 Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579, Japan;
flip chip; residual stress; reliability; 3D packaging; strain sensor;
机译:通过优化电镀材料的机械性能以及TSV和细小凸块的对准结构,使3D倒装芯片结构中的局部残余应力最小化
机译:倒装芯片焊点中凸点冶金条件下电镀镍铜合金的残余应力和界面反应
机译:用于在高密度倒装芯片技术上测量凸点键合良率的测试结构组件
机译:在3D翻转芯片结构中精细的金属凸点之间的局部残余应力的测量。
机译:使用数字图像关联和光学显微镜对倒装芯片焊料凸点进行应变测量
机译:使用超声波传感器检查倒装芯片焊锡凸点的缺陷
机译:使用应变传感器芯片用2-μm长压电仪测量倒装芯片结构中局部二维应力分布的测量
机译:薄基板,精细凸块间距和小型原型模具的倒装芯片组装。