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Procedures for producing solder alloy or tin contact bump structures for non-encapsulated microcircuits simultaneously
Procedures for producing solder alloy or tin contact bump structures for non-encapsulated microcircuits simultaneously
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机译:同时生产用于非封装微电路的焊料合金或锡触点凸点结构的程序
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摘要
The invention relates to a solder or tin contact bump structure and a method for the production thereof for unencapsulated microcircuits (15) comprising a substrate (15), contact pad areas (3) of aluminium formed on said substrate (15), a composite metal structure formed on the contact pad areas (3), formed of a TiW layer (7), an Au layer (4) formed thereon, and an Ni layer (5) formed on said Au layer, and a solder contact bump (6) formed on the composite metal structure (7, 4, 5). According to the invention the TiW layer (7) is sputtered in the presence of nitrogen and argon in connection with the layering, whereafter it is subject to oxygen treatment, and the Au layer (4) is formed by one deposition process only.
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