首页> 外国专利> NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

机译:氮化物半导体器件及其制造方法

摘要

Affords a manufacturing method enabling nitride-based semiconductor devices containing epitaxial films excelling in flatness and crystallinity to be easily produced, and makes available nitride-based semiconductor devices manufactured by the method.;Method of manufacturing nitride semiconductor devices that are formed onto a semiconductor substrate being a compound containing a Group 3B element for forming compounds with nitrogen, and nitrogen, including steps of heating the semiconductor substrate (1) to a film-deposition temperature, supplying to the substrate a film-deposition gas containing a source gas for the Group 3B element and a nitrogen source gas, and epitaxially growing onto the semiconductor substrate a thin film (2) of a compound containing the Group 3B element and nitrogen, and being furnished with a step, in advance of the epitaxial growth step, of heating the semiconductor substrate to a pretreating temperature less than the film-deposition temperature, to clean the surface of the semiconductor substrate.
机译:提出了一种制造方法,该方法使得能够容易地制造包含平坦性和结晶性优异的外延膜的氮化物基半导体器件,并且使得可以利用该方法制造的氮化物基半导体器件。作为包含用于与氮和氮形成化合物的3B族元素的化合物的化合物,其包括以下步骤:将半导体衬底(1)加热到膜沉积温度,向衬底供应包含用于该族的源气体的膜沉积气体。 3B元素和氮源气体,并在半导体衬底上外延生长包含3B族元素和氮的化合物的薄膜(2),并在外延生长步骤之前进行加热步骤。半导体衬底的预处理温度低于成膜温度,以清洁表面半导体基板的表面。

著录项

  • 公开/公告号EP1601009A4

    专利类型

  • 公开/公告日2010-07-14

    原文格式PDF

  • 申请/专利权人 SUMITOMO ELECTRIC INDUSTRIES LTD.;

    申请/专利号EP20040712740

  • 发明设计人 KYONO TAKASHI;UENO MASAKI;

    申请日2004-02-19

  • 分类号H01L21/205;H01L21/31;

  • 国家 EP

  • 入库时间 2022-08-21 18:39:39

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号