Leadframe, semiconductor chip package comprising a leadframe and a method for producing a leadframe

摘要

A leadframe includes a die pad and a terminal finger having an interior portion configured to be electrically connected to pads of a die and an exterior portion having a mounting portion. The mounting portion is configured to be soldered to an external soldering surface, the mounting portion comprising a width, a length and a thickness. An opening extends through the thickness of the attachment portion.