Simulation of Life Testing Procedures for Estimating Long-Term Degradation and Lifetime of AlGaN/GaN HEMTs (Postprint)

摘要

Thermometry and thermo-mechanical: MicroRaman has been used both to track the thermal signatures as devices degrade and to assess the strain evolution within the devices during operation. It was found that both the piezoelectric and thermo-elastic strains decrease the overall strain (reduce the residual strain in the film), with the latter having the greater effect. Modeling: Work has initiated on an improved thermal model that takes into account phonon scattering dynamics. Existing Fourier-based models underpredict the hot spot temperature. Irradiation experiments: Radiation is being explored as a means to controllably damage a device to better understand how specific defects impact performance and lifetime.