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Reliability analysis of AlGaN/GaN HEMT on SopSiC composite substrate under long-term DC-life test

机译:长期DC寿命测试下SopSiC复合衬底上AlGaN / GaN HEMT的可靠性分析

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摘要

This paper report on the long-term stress (1000 h) carried out on AlGaN/GaN HEMTs processed on composite SopSiC substrate. Almost all tested devices present good device stability and promising performance. The reliability issues identified during the work are clearly related to the high levels of gate leakage current. All these results are very encouraging and confirm that the composite substrates are very promising for low-cost and high performance AlGaN/GaN HEMT for RF power applications.
机译:本文报道了在复合SopSiC衬底上处理的AlGaN / GaN HEMT上的长期应力(1000 h)。几乎所有经过测试的设备都具有良好的设备稳定性和良好的性能。在工作中发现的可靠性问题显然与高水平的栅极泄漏电流有关。所有这些结果都令人鼓舞,并证实了复合衬底对于用于射频功率应用的低成本,高性能AlGaN / GaN HEMT非常有希望。

著录项

  • 来源
    《Microelectronics reliability》 |2009年第11期|1207-1210|共4页
  • 作者单位

    Dept. of Information Engineering, University of Padova, Via Gradenigo 6/B, 35131 Padova, Italy;

    Dept. of Information Engineering, University of Padova, Via Gradenigo 6/B, 35131 Padova, Italy;

    Dept. of Information Engineering, University of Padova, Via Gradenigo 6/B, 35131 Padova, Italy;

    Dept. of Information Engineering, University of Padova, Via Gradenigo 6/B, 35131 Padova, Italy;

    Dept. of Information Engineering, University of Padova, Via Gradenigo 6/B, 35131 Padova, Italy;

    Dept. of Information Engineering, University of Padova, Via Gradenigo 6/B, 35131 Padova, Italy;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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